Although the rotary targets have developed in recent years, the mainstream shape of the sputtering target is still the planar type. Today let us take a look at the pros and cons of planar targets to help you determine whether a planar sputtering target is suitable for your project.

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Advantages of Planar Sputter Target

Simple structure – one of the main advantages of the planar target is that the structure is simple. The common planar targets on the market are rectangular planar targets and circular planar targets, which are easily produced by molds. In other words, planar target preparation requires fewer machines and technologies and is easier to prepare. This is why planar targets still dominate the sputtering target market.

Low price – You can never deny that the price is always an important competitive factor. As mentioned above, the manufacturing process of the planar sputter target is easier, so its price is much lower than the rotatory sputter target.

Strong versatility – Planar sputtering targets usually have strong versatility. Therefore, the transportation of the planar targets is relatively simple and is not easily damaged during transportation.

Good uniformity and repeatability – Film layers sputtered by planar targets usually boast good uniformity and repeatability. Planar targets are still best suited for prototype work or elemental experimentation, especially when large amounts of material are not needed at once.

Disadvantages of Planar Sputter Target

Its biggest disadvantage is the low utilization rate (generally only about 20%).  In the sputtering process of the planar target,  a strip-shaped pit will be formed when the target of the glow region (the magnetic field distribution region) is consumed to a certain extent, making the target body thinner. And once the pit depth reaches a certain value, the target cannot be utilized anymore. The low utilization rate also reduces its price advantage to some extent.

In conclusion, planar targets are still the best choice for prototype work or elemental experimentation, especially when large amounts of material are not needed at once. But its disadvantage of low utilization rate (20% vs. 80% compared with the rotatory target) does constrain its development.

Next week, let us look at the biggest competitor of the planar target– the rotatory target. Weighting the pros and cons of these two types of sputtering target may help you better choose the one for your application.

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Author:

SAM Sputter Targets

Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. View all posts by SAM Sputter Targets

Advantages and Disadvantages of Magnetron Sputtering Technology

views, Updated: 2022-09-29

The working principle of magnetron sputtering is that electrons collide with argon atoms in the process of flying to the substrate under the action of electric field E, resulting in AR-positive ions and new electrons.

New electrons fly to the substrate, and Ar ions accelerate to the cathode target under the electric field's action and bombard the target surface with high energy, resulting in sputtering of the target.

 

Since the appearance of magnetron sputtering, it has obtained rapid development and wide application, which has greatly impacted other coating methods. So what are the advantages and disadvantages of magnetron sputtering technology?

 

Advantages of magnetron sputtering technology:

1. The deposition speed is fast, the substrate temperature rise is low, and the damage to the film is small.

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2. For most materials, sputtering can be realized as long as scrape materials can be made.

3. The films obtained by sputtering are well combined with the substrate.

4. The films obtained by sputtering have high purity, good compactness, and good film-forming uniformity.

5. The sputtering process has good repeatability, and the film with a uniform thickness can be obtained on a large area substrate.

6. At the same time, the film's particle size can be controlled by changing the parameters.

7. Different metals, alloys, and oxides can be mixed and sputtered on the substrate simultaneously.

8. Easy to industrialize.

 

Disadvantages of magnetron sputtering technology:

1. The ring magnetic field used by magnetron sputtering forces the secondary electrons to move around the ring magnetic field. Accordingly, the region controlled by the annular magnetic field is the place with the highest plasma density.

We can see that the sputtering gas argon emits a strong light blue glow in this area during magnetron sputtering, forming a halo. The halo's target is the most serious part bombarded by ions, which will splash out a ring-shaped groove. The circular magnetic field is the orbit of electron motion, vividly represented by the circular flow and groove.

Once the sputtering groove of the magnetron sputtering target penetrates the target, the whole target will be scrapped, so the target's utilization rate is not high, generally lower than 40%.
 

2. Plasma instability.
 

3. It is impossible to achieve high-speed sputtering at low temperature for strong magnetic materials because almost all magnetic flux can not pass through the magnetic target, so it is impossible to add an external strengthening magnetic field near the target surface.

 

AEM Deposition, as a professional sputtering target manufacturer, supplies all kinds of pure metal sputtering target, alloy sputtering target, and ceramic compound sputtering target. Further details are as follows:

If you are interested, you can click the relevant link and visit the product page. You can also email us at

If you are interested, you can click the relevant link and visit the product page. You can also email us at

[email protected]

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